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Title:
ADHERENT RESIN COMPOSITION AND LAMINATED PRODUCT FORMED THEREFROM
Document Type and Number:
Japanese Patent JP2000086841
Kind Code:
A
Abstract:

To provide adherent resin compositions for obtaining laminated products improved in gas barrier properties (oxygen, carbon dioxide and the like), mechanical strength, resistance to contents (flavoring, preservation of a fragrance), designing (surface gloss, transparency), and the like.

Adherent resin compositions comprise (a) 1-85 wt.% modified etylene type polymer modified with 0.01-10 wt.% unsaturated carboxylic acid or a derivative thereof which has a melt flow rate(MFR) of 0.05-50 g/10 min and a density of 0.880-0.950 g/cm3, (b) 1-59 wt.% tackifier, and (c) 5-80 wt.% hydrogenated block copolymer obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound, with the proviso that the sum of the C4 contents in components (a) and (c) of the composition is not less than 8.0 wt.% and, at the same time, the ratio of the sum of the C4 contents in components (a) and (c) to the weight of component (b) is not more than 5.0.


Inventors:
IKEDA MUTSUKO
Application Number:
JP25685098A
Publication Date:
March 28, 2000
Filing Date:
September 10, 1998
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
B32B27/32; B32B27/36; C08L23/08; C08L23/26; C08L53/02; C08L57/02; C08L93/04; (IPC1-7): C08L23/26; B32B27/32; B32B27/36; C08L23/08; C08L53/02; C08L57/02; C08L93/04
Attorney, Agent or Firm:
Kazuo Sato (2 outside)