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Patent Searching and Data


Title:
ADHESION APPARATUS, ADHESION SYSTEM AND ADHESION METHOD
Document Type and Number:
Japanese Patent JP2014030986
Kind Code:
A
Abstract:

To provide an adhesion apparatus that can improve uniformity of adhesion when performing adhesion of an adhesion member to a substrate.

An adhesion apparatus includes: a chamber C; a member holding mechanism disposed in the chamber C and holding an adhesion member; a chamber transfer mechanism 18 transferring the chamber C; and a mechanism supplying gas for compression in the chamber C, wherein the adhesion member held at the member holding mechanism is contacted to a substrate held by the substrate holding mechanism, then the adhesion member held by the member holding mechanism is adhered to the substrate held by the substrate holding mechanism in the chamber supplied by the gas for compression.


Inventors:
TOMEZUKA KOJI
Application Number:
JP2012174053A
Publication Date:
February 20, 2014
Filing Date:
August 06, 2012
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B29C65/00; B41F16/00; G11B5/84; G11B7/26
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito