Title:
接着方法、及び接着剤
Document Type and Number:
Japanese Patent JP7421713
Kind Code:
B2
Abstract:
Provided are a bonding method and an adhesive that can provide portability in a short time, a low elastic modulus immediately after thermal curing, and the relaxation of thermal strain. The bonding method is a method for bonding a first adherend and a second adherend different from the first adherend with an adhesive, the adhesive containing a crosslinkable silicon group-containing polyoxyalkylene-based polymer, a crosslinkable silicon group-containing (meth)acrylic polymer, and an epoxy resin, the method including an application step of applying the adhesive to at least one of the first adherend and the second adherend, a bonding step of bonding the second adherend to the first adherend with the adhesive to form a structure, and a heating step of heating the resulting structure to cure the adhesive, in which after the heating step, in the case where the structure is matured at ordinary temperature, the adhesive has a storage modulus that increases as the maturing time elapses.
Inventors:
Shingo Yano
Yu Tokita
Hideharu Hashimukai
Masato Akimoto
Yu Tokita
Hideharu Hashimukai
Masato Akimoto
Application Number:
JP2020523659A
Publication Date:
January 25, 2024
Filing Date:
May 29, 2019
Export Citation:
Assignee:
Cemedine Co., Ltd.
International Classes:
C09J183/12; C09J5/04; C09J11/04; C09J133/00; C09J163/00; C09J171/02
Domestic Patent References:
| JP2015222007A | ||||
| JP2004323589A | ||||
| JP3193185A |
Attorney, Agent or Firm:
Yasuyuki Yamada
Tatsuya Ando
Tatsuya Ando