ADHESION METHOD AND HOT MELT ADHESIVE FILM FOR INDUCTION HEATING

Japanese Patent JP2023137899

A

To provide an adhesion method and a hot melt adhesive film for induction heating.SOLUTION: An adhesion method for bonding an adherend 1 made of a resin (1) and an adherend 2 made of a resin (2) different from the resin (1) includes the steps of: obtaining a laminate by laminating the adherend 1, hot melt adhesive film for induction heating and the adherend 2 in this order; and heating the hot melt adhesive film for induction heating by using an induction heating device. The hot melt adhesive film for induction heating is a hot melt adhesive film for induction heating, comprising a thermoplastic resin layer (A') comprising thermoplastic resin (A), a metal layer, and a thermoplastic resin layer (B') comprising thermoplastic resin (B), laminated in this order. In the laminate, the adherend 1 and the thermoplastic resin layer (A') are in contact with each other, and the adherend 2 and the thermoplastic resin layer (B') are in contact with each other.SELECTED DRAWING: None

JPS5976220	BONDING METHOD FOR SYNTHETIC RESIN PANEL FOR AUTOMOBILE
WO/2001/044004	TRANSPARENT PLATE WITH MOLDING, AND METHOD OF REMOVING TRANSPARENT PLATE
WO/2015/150380	INTERMEDIATE WELDING DEVICE

MARUYAMA YUIKO
TAKEYAMA SHUNSUKE

JP2022044326A

September 29, 2023

March 18, 2022

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FUJIMORI KOGYO CO

B29C65/36; B29C65/40; B32B15/08; B32B27/00; C09J5/00; C09J201/00

田▲崎▼ 聡
Onami Kazunori
Tomoyuki Sadahiro

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