Title:
ADHESION METHOD USING THIN ADHESIVE LAYERS
Document Type and Number:
Japanese Patent JP2018193561
Kind Code:
A
Abstract:
To provide: a method for adhesively bonding flexible substrates, the connecting adhesive layer being formed in a thin form; and a composite substrate where two substrates are connected by a thin flexible adhesive layer.SOLUTION: A method for adhesively bonding two substrates comprises applying a polyurethane-, EVA- or polyacrylate-based adhesive at a coating weight of less than 2 g/monto a first substrate; bringing the substrate together with a second film-shaped substrate made of a thermoplastic; converting the surface of the second substrate into a softened state by heating; and adhesively bonding the substrates to one another by means of pressure before, during and/or immediately after the heating.SELECTED DRAWING: None
Inventors:
HANS-GEORG KINZELMANN
MICHAEL GIERLINGS
MICHAEL GIERLINGS
Application Number:
JP2018139159A
Publication Date:
December 06, 2018
Filing Date:
July 25, 2018
Export Citation:
Assignee:
HENKEL AG & CO KGAA
International Classes:
C09J5/06; B05D3/02; B05D5/10; B05D7/24; B29C65/02; B29C65/48; B32B27/28; B32B27/30; B32B27/40; B32B37/04; B32B37/12; C09J7/20; C09J123/08; C09J131/04; C09J133/00; C09J175/04
Attorney, Agent or Firm:
Michiko Matsutani
Kenichi Morizumi
Kenichi Morizumi