To provide an adhesive for bonding in a mold, preventing the adhesive applied to the surface of a metal insert from being flown away by a flowing pressure of a molten resin in an injection molding, bonding the metal insert with the resin by the heat of the molten resin in the molding and preventing the peeling off of the boundary of the metal and resin on releasing the mold.

By using 2 kinds of curing agents consisting of a normal temperature curing agent and a latent curing agent, added to an adhesive epoxy base material applied to the metal insert for bonding the metal insert with the resin, the adhesive is semi-cured at normal temperature by the action of the former and prevents the adhesive from being flown away by the flowing pressure of the molten resin in the injection molding. The latter is activated by the heat of the molten resin in the injection molding to bond the resin with the metal insert, and prevents the peeling off of the boundary of the resin with the metal on releasing the resin from the mold.