Title:
ADHESIVE-COATED TAPE FOR TAB, TAB TAPE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3700297
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of the insulation of a TAB tape or adhesion of TAB leads by strictly controlling the fluidity of adhesive so that the max. overhang of an adhesive-coated tape for TAB is at most a specified value.
SOLUTION: An adhesive-coated tape for TAB is a laminate of an insulation film 1, adhesive 2 and protective film as a basic structure. The protective film is used for the dust proofing and handling purpose. The adhesive-coated tape has a max. overhang(OH) of 20μm, pref. 2-20μm at a Cu foil laminating process. If an adhesive-coated tape having an OH value of over 20μm, foams are produced in the adhesive heating to cure step and thermally broken into defective connections or resulting in peel because of poor adhesion of TAB leads when the IC mounting or connection to a circuit board.
Inventors:
Yasuhiro Koyama
Akihiro Kabashima
Tokunaga Masami
Akihiro Kabashima
Tokunaga Masami
Application Number:
JP32524796A
Publication Date:
September 28, 2005
Filing Date:
December 05, 1996
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J161/06; C09J177/00; H01L21/60; C09J7/02; H05K3/38; (IPC1-7): H01L21/60; C09J7/02
Domestic Patent References:
| JP6322348A | ||||
| JP8008306A |
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