To improve the adhesion property and insulation reliability by stacking an adhesive layer and protective film layer on an org. flexible insulative film; the adhesive layer contg. a polyamide resin and at least one heterocyclic aromatic compd. meeting specified conditions.
An adhesive agent layer 2 and protective film layer are stacked on an org. flexible insulative film 1 to form a laminate, the adhesive layer 2 of which layer contains a polyamide resin and at least one heterocyclic aromatic compd. meeting the condition that it has a 5- or 6-component ring in the molecule contg. three or more N atoms in a heterocyclic structure, a 5- or 6-component ring in the molecule contg. one or more N atoms one or more O atoms in a heterocyclic structure. Thus, the adhesive property and insulation reliability are improved.
KIGOSHI SHOJI
HATANO HIROSHI