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Title:
ADHESIVE-COATED TAPE FOR TAB, SEMICONDUCTOR CONNECTION BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH09237809
Kind Code:
A
Abstract:

To improve the adhesion property and insulation reliability by stacking an adhesive layer and protective film layer on an org. flexible insulative film; the adhesive layer contg. a polyamide resin and at least one heterocyclic aromatic compd. meeting specified conditions.

An adhesive agent layer 2 and protective film layer are stacked on an org. flexible insulative film 1 to form a laminate, the adhesive layer 2 of which layer contains a polyamide resin and at least one heterocyclic aromatic compd. meeting the condition that it has a 5- or 6-component ring in the molecule contg. three or more N atoms in a heterocyclic structure, a 5- or 6-component ring in the molecule contg. one or more N atoms one or more O atoms in a heterocyclic structure. Thus, the adhesive property and insulation reliability are improved.


Inventors:
KONISHI YUKITSUNA
KIGOSHI SHOJI
HATANO HIROSHI
Application Number:
JP34849396A
Publication Date:
September 09, 1997
Filing Date:
December 26, 1996
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
B32B7/12; C09J7/02; C09J177/06; H01L21/60; (IPC1-7): H01L21/60; B32B7/12; C09J7/02; C09J177/06