Title:
接着剤組成物及び接着性フィルム
Document Type and Number:
Japanese Patent JP4577895
Kind Code:
B2
Abstract:
To provide an adhesive composition excellent in bonding property, and giving a cured material having a low elastic modulus and excellent in heat resistance, and an adhesive film equipped with the adhesive layer.
This adhesive composition contains (A) 100 pts.mass polyimide resin having a diorganopolysiloxane residue in its main chain, (B) 5-200 pts.mass epoxy resin and (C) an effective amount of an epoxy resin-curing catalyst, and also (D) 5-100 pts.mass hydrogenated 1,2-polybutadiene resin and/or hydrogenated 1,2-polybutadiene derivative resin based on 100 pts mass total of the (A), (B) and (C).
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
Shohei Kosakai
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Application Number:
JP2005170723A
Publication Date:
November 10, 2010
Filing Date:
June 10, 2005
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J179/08; C09J7/02; C09J11/06; C09J109/00; C09J163/00; H01L21/52
Domestic Patent References:
| JP2003193016A | ||||
| JP9328665A | ||||
| JP827427A | ||||
| JP2006165045A |
Attorney, Agent or Firm:
Mitsuo Matsui