Title:
接着剤組成物及び接着フィルム
Document Type and Number:
Japanese Patent JP4586966
Kind Code:
B2
Abstract:
To provide an adhesive composition excellent in adhesivity and heat resistance and capable of yielding a low-modulus cured product, and to provide an adhesive film using the composition.
The adhesive composition essentially comprises (A) a polyimide resin having epoxy group-containing diorganopolysiloxane linkage, obtained by addition reaction between (i) a polyimide resin having vinyl group-containing diorganopolysiloxane linkage as organic substituent on the main chain and (ii) an organohydrogenpolysiloxane having in the molecule silicon atom-bound hydrogen atom and epoxy group using (iii) a platinum-based catalyst, (B) an epoxy resin and (C) an epoxy resin curing catalyst.
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Shohei Kosakai
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Application Number:
JP2004179956A
Publication Date:
November 24, 2010
Filing Date:
June 17, 2004
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J179/08; C09J7/02; C09J11/06; C09J163/00; C09J183/08; C09J183/10
Domestic Patent References:
| JP2002371132A | ||||
| JP2004010849A | ||||
| JP2004051794A | ||||
| JP7268098A | ||||
| JP4031441A | ||||
| JP2004172180A | ||||
| JP2002064252A | ||||
| JP2005089678A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa