To provide an adhesive composition capable of being formed into a cured product having a low elastic modulus and excellent adhesion and heat resistance, and to provide an adhesive film given by using the composition.

This adhesive composition contains (A) a polyimide resin having a diorganopolysiloxane bond and a phenolic hydroxy group in a polymer skeleton thereof, (B) an epoxy resin, (C) an epoxy resin-curing catalyst, and (D) a carboxy group-containing ethylene/acrylic rubber as essential components. The adhesive film is obtained by using the adhesive composition. The adhesive film obtained from the adhesive composition gives high adhesive force to every kind of base material through thermocompression bonding and heat curing, has the low elastic modulus and high heat resistance, and produces a resin-packaged semiconductor device having high reliability.

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