Title:
接着剤組成物及び接着フィルム
Document Type and Number:
Japanese Patent JP5675975
Kind Code:
B2
Abstract:
Provided is an adhesive composition which is free from halogens and has improved adhesiveness and improved long-term reliability compared with the conventional adhesive compositions. The adhesive composition comprises, per 100 parts by weight of a polyether-ester amide, 1-100 parts by weight of a crystalline polyester and 20-110 parts by weight of silica. A conductive paste can be prepared by adding conductive particles to the aforesaid adhesive composition.
Inventors:
木下 淳一
寺田 恒彦
寺田 恒彦
Application Number:
JP2013517838A
Publication Date:
February 25, 2015
Filing Date:
May 10, 2012
Export Citation:
Assignee:
タツタ電線株式会社
International Classes:
C09J177/12; C09J7/10; C09J9/02; C09J11/00; C09J11/04; C09J167/00
Domestic Patent References:
| JP2001354938A | 2001-12-25 | |||
| JP2006152233A | 2006-06-15 | |||
| JP2002138269A | 2002-05-14 | |||
| JP2010168510A | 2010-08-05 | |||
| JPS61108676A | 1986-05-27 |
Attorney, Agent or Firm:
Masato Tsutada
Tetsushi Nakamura
Katsuyuki Tomita
Husband Shijin
Shoko Tsutada
Tetsushi Nakamura
Katsuyuki Tomita
Husband Shijin
Shoko Tsutada
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