Title:
粘着剤組成物、粘着テープ、及び、電子部品の処理方法
Document Type and Number:
Japanese Patent JP7433228
Kind Code:
B2
Abstract:
The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.
Inventors:
Norishige Shichiri
Application Number:
JP2020529778A
Publication Date:
February 19, 2024
Filing Date:
March 19, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J179/08; C08F290/00; C08G73/10; C09J4/00; C09J7/38; C09J11/06; H01L21/304
Domestic Patent References:
| JP2014162801A | ||||
| JP2013077521A | ||||
| JP2014047312A | ||||
| JP2015199794A | ||||
| JP2013204023A | ||||
| JP2017122157A | ||||
| JP2016132736A |
Foreign References:
| WO2019039340A1 | ||||
| WO2013105582A1 | ||||
| WO2014058056A1 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus