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Title:
ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION AND CIRCUIT CONNECTION STRUCTURE AND SEMICONDUCTOR DEVICE USING IT
Document Type and Number:
Japanese Patent JP2006257200
Kind Code:
A
Abstract:

To provide an adhesive composition and an adhesive composition for circuit connection which exhibits an excellent property balance in transfer to an adherend and temporary fix to a flexible substrate and a circuit connection structure and a semiconductor device using the composition.

The adhesive composition contains (1) a radical generator, (2) a thermoplastic composition and (3) a urethane (meth)acrylate having not less than two radically polymerizable functions and a weight average molecular weight of ≥3,000 and ≤30,000.


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Inventors:
IZAWA HIROYUKI
KATOGI SHIGEKI
SUDO TOMOKO
YUSA MASAMI
Application Number:
JP2005074913A
Publication Date:
September 28, 2006
Filing Date:
March 16, 2005
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J175/16; C09J4/00; C09J9/02; C09J11/04; C09J201/00; H01B1/20
Domestic Patent References:
JPH08188757A1996-07-23
JPH0649420A1994-02-22
JP2001226647A2001-08-21
JP2000256641A2000-09-19
JP2004327801A2004-11-18
Foreign References:
WO2001015505A12001-03-01



 
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