低分子量高分子添加剤を含有する接着剤組成物

Japanese Patent JP2004509213

A

Adhesive compositions comprising (a) adhesive polymers or copolymers prepared from monomers selected from the group consisting of styrene, butadiene, acrylonitrile, ethylene, vinyl acetate, acrylic acid, esters of acrylic acid, methacrylic acid and esters of methacrylic acid or combinations thereof; and (b) from 1 to 55% on a dry weight basis of a polymeric additive comprising a low molecular weight polymer having a number average molecular weight of 20,000 or less and which comprises polymerized units of at least one ethylenically unsaturated monomer and 5 weight percent or less of a polymerized acid-containing monomer. In preferred form, the polymeric additive is polymerized in the presence of a metal chelate chain transfer agent. In certain embodiments, the polymeric additive has a midpoint Tg of at least 0° C. or greater. Further embodiments of the present invention include methods for forming the polymeric additive in situ in the adhesive composition.

Lawy, Willie
Ho, Kim Sun
Van Reinen, Paul Ralph

JP2002526996A

March 25, 2004

September 13, 2001

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ROHM AND HAAS COMPANY

C09J133/10; B32B27/08; C08F4/00; C08F4/16; C08F257/02; C08F265/04; C08F265/06; C08F290/00; C08F290/04; C08F290/06; C08F291/00; C08F293/00; C08L23/08; C08L23/20; C08L25/12; C08L27/06; C08L27/24; C08L51/00; C08L53/00; C08L53/02; C08L67/02; C08L67/06; C08L69/00; C08L77/00; C08L77/02; C08L77/06; C08L101/00; C09D151/00; C09D153/00; C09J11/00; C09J11/08; C09J125/04; C09J133/00; C09J133/02; C09J133/06; C09J151/00; C09J157/00; C08L23/10; C08L23/16; C08L23/22; C08L33/00; C08L33/06; C08L33/10; (IPC1-7): C09J133/10; C09J11/08; C09J125/04; C09J133/02; C09J133/06; C09J157/00

JPH01139665A	1989-06-01
JPH10279907A	1998-10-20
JPS6395215A	1988-04-26
JPH02167380A	1990-06-27
JPH11509877A	1999-08-31

Minoru Senda
Hisashi Tsuji
Koji Hashimoto

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