Title:
接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
Document Type and Number:
Japanese Patent JP6973411
Kind Code:
B2
Abstract:
An adhesive composition containing (A) a modified polyolefin resin and (B) an epoxy compound, wherein the modified polyolefin resin (A) is a polyolefin resin graft modified with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof. The content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds.
Inventors:
Makoto Hirakawa
Shigeshi Yamada
Shigeshi Yamada
Application Number:
JP2018557728A
Publication Date:
November 24, 2021
Filing Date:
December 15, 2017
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
C09J123/26; B32B7/12; B32B15/088; B32B27/34; C09J7/22; C09J11/04; C09J11/06; C09J151/06; C09J163/00; C09J163/02; C09J163/04; H01B1/20
Domestic Patent References:
| JP2002088332A | ||||
| JP5700166B2 | ||||
| JP2007251138A | ||||
| JP2016151046A | ||||
| JP2014141603A | ||||
| JP2013159762A | ||||
| JP2016089090A |
Foreign References:
| WO2015190411A1 | ||||
| WO2016042837A3 | ||||
| WO2016047289A3 |