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Title:
ADHESIVE COMPOSITION, ELECTRONIC MEMBER USING THE ADHESIVE COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015140409
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive having transparency after curing, capable of being cured at low temperature (for example at 100°C or less), high in elastic modulus of a cured product at room temperature (for example at 25°C), having excellent adhesiveness to a substrate and excellent in reflow detachment resistance at 260°C.SOLUTION: There is provided an adhesive composition containing (a) an urethane compound having at least one (meth)acryloyl group, (b) a compound having at least two (meth)acryloyl group and (c) an organic peroxide having 1 hour half-life temperature of 70 to 115°C.

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Inventors:
IKEDA AYA
FUJII SHINJIRO
KATO SADAAKI
KIKUCHI SHOGO
HASHIMOTO SHU
Application Number:
JP2014014866A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J175/14; C09J4/02; C09J11/06; H01L21/52
Domestic Patent References:
JP2013241508A2013-12-05
JP2013018181A2013-01-31
JP2010106261A2010-05-13
JP2011183735A2011-09-22
JP2001257219A2001-09-21
JP2014160546A2014-09-04
JP2011202173A2011-10-13
JP2008308513A2008-12-25
JP2013144793A2013-07-25
JPH11189747A1999-07-13
JP2014022229A2014-02-03
JPH1067977A1998-03-10
JP2006202926A2006-08-03
JP2005259192A2005-09-22
JP2013227420A2013-11-07
Foreign References:
WO2012014562A12012-02-02
WO2011001942A12011-01-06
WO2012066897A12012-05-24
WO2014050455A12014-04-03
WO2012026470A12012-03-01
WO2012157375A12012-11-22
WO2013022096A12013-02-14
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Junichiro Sakamaki



 
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