Title:
ADHESIVE COMPOSITION, FILM OF ADHESIVE, AND SHEET OF ADHESIVE
Document Type and Number:
Japanese Patent JP2003206466
Kind Code:
A
Abstract:
To provide an adhesive composition capable of giving adhesive strength which does not depend on thickness of an adhesive formed therefrom and capable of exhibiting stable adhesion to various adherends having smooth surfaces on which roughened shapes are formed extremely few.
This adhesive composition contains (A) a resin which contains amide groups in its molecule and has an amide equivalent of 450-800, (B) an epoxy resin, and (C) a compound which contains two or more NH groups in its molecule and has a molecular weight of ≤500.
Inventors:
TANAKA HIROKO
TAKEUCHI KAZUMASA
TAKEUCHI KAZUMASA
Application Number:
JP2002006312A
Publication Date:
July 22, 2003
Filing Date:
January 15, 2002
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/00; C09J7/02; C09J163/00; C09J179/08; C09J183/10; (IPC1-7): C09J179/08; C09J7/00; C09J7/02; C09J163/00; C09J183/10
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)