Title:
ADHESIVE COMPOSITION, ADHESIVE FILM, AND ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2011074110
Kind Code:
A
Abstract:
To provide an adhesive composition, an adhesive film and an adhesive tape excellent in adhesiveness at ambient temperature, heat resistant adhesiveness, adhesiveness at ambient temperature after left at high temperature, and heat resistant adhesiveness after left at high temperature.
The adhesive composition includes the following components: (A) an acrylic elastomer, (B) an resol type phenolic resin, (C) a maleimide-containing compound, (D) an amine compound, and (E) an epoxy resin, wherein the acrylic elastomer (A) contains a nitrile group and an epoxy group, Tg is ≥-10°C, and a weight average molecular weight is ≥300,000.
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Inventors:
IWABUCHI TATSURU
TOCHIHIRA JUN
TOCHIHIRA JUN
Application Number:
JP2009224000A
Publication Date:
April 14, 2011
Filing Date:
September 29, 2009
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C09J133/00; C09J7/00; C09J7/02; C09J11/06; C09J161/12; C09J163/00; C09J179/04
Domestic Patent References:
JPH09328665A | 1997-12-22 | |||
JP2006283002A | 2006-10-19 |