To provide an adhesive composition capable of being stably stored for a long period and capable of being hardened in a short time, when used in mounting a semiconductor chip on a wiring board, such as a glass-epoxy board and a flexible board, which is called an interposer, and to provide an adhesive film.
This adhesive composition contains 100 pts.wt. of (a) a mixture of (a1) an epoxy resin, (a2) a hardener, and (a3) a latent hardener or a latent hardening accelerator of which the both have surfaces covered with an active group-protecting material, 10-500 pts.wt. of (b) a polymer compound which is soluble in an organic solvent having a SP (solubility parameter) of 8.2-9.0 (cal/cm3)1/2 and has a weight-average molecular weight of 10,000-2,000,000, and 20-30,000 pts.wt. of (c) the organic solvent which has the SP of 8.2-9.0 (cal/m3)1/2. The adhesive film has a filmlike adhesive layer which is given by forming the adhesive composition into a filmlike material and heating the material to remove the organic solvent.
SUZUKI MASAO
IWAKURA TETSUO
