PURPOSE: To obtain an adhesive compsn. which is used for flexible printed circuit boards, is excellent in resistance to soldering heat, adhesive properties, and esp. the adhesive strength and migration resistance after solder dipping, and exhibits an improved workability in the semicured state by compounding an epoxy resin, a specific acrylic rubber, and a flame-retardant filler.

CONSTITUTION: This compsn. is prepd. by homogeneously dissolving or dispersing, in a solvent (e.g. a methyl ethyl ketone-toluene mixture), at least one polyepoxy resin, an acrylic rubber produced by copolymerizing an acrylic ester with a comonomer component at least contg. acrylonitrile or by modifying such an acrylic rubber and having an actrylonitrile content of 10-30wt.%, a flame-retardant filler (e.g. aluminum hydroxide or silica) in an amt. of 15-40wt.% of the resin content of the compsn., and if necessary, a fine antioxidant powder, a fine pigment power, etc.