Title:
ADHESIVE COMPOSITION, LAMINATE FILM, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2022121248
Kind Code:
A
Abstract:
To provide an adhesive composition that has low dielectric constants and high storage stability, a laminate film having a cured layer of the adhesive composition, and a printed wiring board including the laminate film.SOLUTION: An adhesive composition contains a modified thermoplastic elastomer and a curing agent and has a dielectric constant of 2.0-3.0. Relative to 100 pts.wt. of the modified thermoplastic elastomer, it contains an oxetane resin of 5 pts.wt. or more and less than 200 pts.wt.SELECTED DRAWING: None
Inventors:
ITO HIROSHI
HARADA RYU
HARADA RYU
Application Number:
JP2021018504A
Publication Date:
August 19, 2022
Filing Date:
February 08, 2021
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C09J201/00; B32B15/08; B32B27/00; C09J11/00; C09J123/00; C09J123/10; C09J125/04; C09J153/00; C09J171/00; C09J201/08; H05K1/03
Attorney, Agent or Firm:
Sumio Tanai
Shiro Suzuki
Yuichiro Kawagoe
Shiro Suzuki
Yuichiro Kawagoe