Title:
ADHESIVE COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023117970
Kind Code:
A
Abstract:
To provide an adhesive composition which dispenses with a separation layer, a laminate manufactured using the adhesive composition, a method for manufacturing the laminate, and a method for manufacturing an electronic component using the adhesive composition.SOLUTION: An adhesive composition is used for forming an adhesive layer for temporarily bonding a semiconductor substrate or an electronic device to a support for transmitting light, and contains a urethane resin (P1) containing a polymerizable carbon-carbon unsaturated bond, and a polymerization initiator (A), wherein the urethane resin (P1) has a structural unit (u1) having such a structure as to absorb at least a part of light of a wavelength of 300-800 nm.SELECTED DRAWING: None
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Inventors:
MARUYAMA TAKASHI
TOMIOKA YUKI
UNO KAZUHIDE
TOMIOKA YUKI
UNO KAZUHIDE
Application Number:
JP2022020810A
Publication Date:
August 24, 2023
Filing Date:
February 14, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
C09J175/14; B32B7/06; B32B7/12; B32B27/40; C09J11/06; H01L21/02
Attorney, Agent or Firm:
田▲崎▼ 聡
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi
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