To obtain both an adhesive composition capable of forming an adhesive member having heat and moisture resistances required when a semiconductor element having a large difference in coefficient of thermal expansion is packaged in a substrate for loading a semiconductor and capable of suppressing volatiles during the use thereof and the adhesive member using the adhesive composition and to provide both the substrate for loading the semiconductor and a semiconductor device.
This adhesive composition comprises (A) an epoxy resin and (B) a modified polyamideimide resin prepared by reacting a mixture of (c) an aromatic polyisocyanate with (d) a trivalent polycarboxylic acid having an acid anhydride group and (e) a dicarboxylic acid represented by general formula (I) (wherein, a is an integer of 0-20; b is an integer of 0-70; c is an integer of 1-90; and R1 and R2 are each hydrogen or a 1-3C alkyl group) in a nitrogen-free polar solvent. The adhesive member uses the adhesive composition. The substrate for loading the semiconductor and the semiconductor device are provided with the adhesive member.
INADA TEIICHI
IWAKURA TETSUO
