Title:
半導体回路接続用接着剤組成物およびこれを含む接着フィルム
Document Type and Number:
Japanese Patent JP6983461
Kind Code:
B2
Abstract:
The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
Inventors:
Ju Hyun Kim
Junhaku Kim
Seung Hee Nam
Kwan Ju Yi
Junhaku Kim
Seung Hee Nam
Kwan Ju Yi
Application Number:
JP2020526595A
Publication Date:
December 17, 2021
Filing Date:
April 17, 2019
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/60; C09J7/30; C09J11/06; C09J163/00; C09J201/00; H01L21/52; H01L23/29; H01L23/31
Domestic Patent References:
| JP2014197675A | ||||
| JP2016029152A | ||||
| JP2012046715A | ||||
| JP2016183317A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe