Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE, AND ADHESIVE SHEET PREPARED BY USING THE COMPOSITION, SEMICONDUCTOR-CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2001354938
Kind Code:
A
Abstract:
To obtain an adhesive composition for semiconductors, which, while retaining excellent insulation properties, can achieve excellent adhesiveness, warpage prevention, and temperature cycle endurance, and to prepare an adhesive sheet and to provide a semiconductor device both prepared by using the same.
This adhesive composition contains, as an essential ingredient, a polyesteramide having ester groups in the main chain. Both the adhesive sheet and the semiconductor device are prepared by using the composition.
Inventors:
KIGOSHI SHOJI
TSUTSUMI YASUAKI
SHINOHARA HIDEKI
TSUTSUMI YASUAKI
SHINOHARA HIDEKI
Application Number:
JP2000175114A
Publication Date:
December 25, 2001
Filing Date:
June 12, 2000
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09J7/02; C09J161/06; C09J163/00; C09J177/12; H01L21/52; H01L21/60; H01L23/14; H01L23/373; H01L23/50; (IPC1-7): C09J177/12; C09J7/02; C09J161/06; C09J163/00; H01L21/52; H01L21/60; H01L23/14; H01L23/373; H01L23/50
Domestic Patent References:
| JPH10183073A | 1998-07-07 | |||
| JPH10183074A | 1998-07-07 | |||
| JPS56160091A | 1981-12-09 | |||
| JPH0551571A | 1993-03-02 | |||
| JPH11260864A | 1999-09-24 | |||
| JPH07226581A | 1995-08-22 | |||
| JPH0959573A | 1997-03-04 | |||
| JPH11100553A | 1999-04-13 |
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