Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003176471
Kind Code:
A
Abstract:
To provide a new adhesive sheet for a semiconductor device excellent in wire bonding properties, adhesive properties and solder heat resistance, and to provide a semiconductor device using the same.
An adhesive composition for a semiconductor device contains a polyester amide and a phenol resin in the adhesive as the indispensable components and the adhesive layer manifests ≤40 of haze, and the adhesive sheet for the semiconductor device comprises the adhesive layer and at least an organic insulating film layer and contains the polyester amide and the phenol resin as the indispensable components and the adhesive layer manifests ≤40 of haze.
Inventors:
SHIMIZU TAKESHI
KONISHI YUKITSUNA
KAMEI RYUICHI
KONISHI YUKITSUNA
KAMEI RYUICHI
Application Number:
JP2001376856A
Publication Date:
June 24, 2003
Filing Date:
December 11, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09J7/02; C09J161/06; C09J177/12; (IPC1-7): C09J177/12; C09J7/02; C09J161/06