ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR-BONDING SUBSTRATE USING THE SAME AND SEMICONDUCTOR DEVICE

Title:

ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR-BONDING SUBSTRATE USING THE SAME AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2004277478

Kind Code:

A

Abstract:

To provide an adhesive composition which is used for semiconductor devices, gives adhesive layers having high elastic moduli at high temperature, has a high wire bonding property, and gives scarcely bending adhesive sheets, to provide an adhesive sheet for semiconductor devices, to provide a semiconductor device substrate using the same, and to provide a semiconductor using the same.

This adhesive composition containing a phenolic resin (A), a thermosetting resin (B) and inorganic particles (C) as essential components is characterized in that the pH value of extraction water obtained by extracting the adhesive composition with pure water in an amount of 1,000 weight times the weight of the solid content under conditions of 121°C/100 %RH for 10 hours is ≥5 and that the elastic modulus of the adhesive composition has ≥60 MPa at 150°C, after thermally cured.

Inventors:

SHIMIZU TAKESHI
FUJIMARU KOICHI
KIGOSHI SHOJI

Application Number:

JP2003067797A

Publication Date:

October 07, 2004

Filing Date:

March 13, 2003

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C09J7/02; C09J161/06; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): C09J161/06; C09J7/02; C09J163/00; C09J177/00; H01L21/60

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