Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE USING IT
Document Type and Number:
Japanese Patent JP2006117824
Kind Code:
A
Abstract:

To provide an adhesive composition for semiconductor devices which has low hygroscopicity, strong adhesivity and high reflow resistance.

The adhesive composition for semiconductor devices contains (A) at least one kind of thermoplastic resin selected from a copolymer whose copolymerizing components are acrylonitrile and butadiene, a copolymer whose copolymerizing components are styrene, butadiene and ethylene, a copolymer whose copolymerizing components are an acrylate having a 1-8C side chain and a methacrylate and a polyamide, (B) an epoxy resin and (C) an episulfide resin.


More Like This:
JPH0860135ELASTIC ADHESIVE
WO/2012/154132ADHESIVE/SEALANT PREFERABLY USED FOR CONSTRUCTION PANELS
JP6646877Polyarylene sulfide resin composition, molded product, composite molded product and method for producing composite molded product
Inventors:
SHINOHARA HIDEKI
NISHIOKA DAIKICHI
TSUCHIYA HIROSHI
Application Number:
JP2004308053A
Publication Date:
May 11, 2006
Filing Date:
October 22, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES
International Classes:
C09J181/04; C08K3/00; C08L63/00; C08L81/02; C08L101/00; C09J7/02; C09J11/04; C09J109/00; C09J133/04; C09J163/00; C09J177/00



 
Previous Patent: TWO PACK-TYPE SILICONE RUBBER COMPOSITION

Next Patent: FUEL GAS ODORIZER