To provide an adhesive composition giving an adhesive cured layer having high adhesion force to various substrates and useful for stably manufacturing semiconductor devices of high reliability, and to provide an adhesive sheet and a dicing die attach film using the composition.

The adhesive composition contains (A) a glycidyl group-containing (meth)acrylic resin having a weight average molecular weight of 100,000 to 1,500,000, and (B) a polyimide resin having an organopolysiloxane structure, a weight average molecular weight of 500 to 20,000, an amino group at the molecular end, and 50 to 100 mol% of structural units having an organopolysiloxane structure in the whole structural units. The adhesive sheet comprises a substrate and an adhesive layer comprising the composition formed on the substrate. The dicing die attach film includes a dicing film comprising a substrate and a pressure-sensitive adhesive layer formed thereon, and an adhesive layer comprising the composition on the pressure-sensitive adhesive layer of the dicing film.

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