Title:
接着剤組成物及び構造体
Document Type and Number:
Japanese Patent JP7172990
Kind Code:
B2
Abstract:
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxetane resin; and a second silane compound that reacts with the first silane compound.
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Inventors:
Tomoki Morijiri
Mori Akatsuki Rei
Nao Kudo
Hiroyuki Izawa
Masaru Tanaka
Kazuya Matsuda
Mori Akatsuki Rei
Nao Kudo
Hiroyuki Izawa
Masaru Tanaka
Kazuya Matsuda
Application Number:
JP2019510011A
Publication Date:
November 16, 2022
Filing Date:
March 28, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C09J163/00; C09J9/02; C09J11/04; C09J171/00; C09J171/10; H05K1/14; H05K3/32
Domestic Patent References:
| JP2002285103A | ||||
| JP2007142117A | ||||
| JP2002249544A | ||||
| JP2013107814A | ||||
| JP2011190339A | ||||
| JP2006016580A | ||||
| JP2007317563A |
Foreign References:
| WO2016052664A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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