To provide an adhesive composition having high bond strength, excellent in heat resistance, and easy to peel by irradiating light of a wavelength of 300 nm or more, which does not deteriorate a semiconductor wafer and the like, an adhesive tape using the adhesive composition, and a method for processing a semiconductor wafer and a method for producing a TSV wafer.

An adhesive composition includes: an adhesive component; and tetrazole compounds or salts thereof represented by general formula (1), general formula (2), or general formula (3); and an intramolecular cleaving type photosensitiser of oligomeric type which is miscible with the tetrazole compounds or the salts thereof.