Title:
ADHESIVE COMPOSITION FOR WOOD
Document Type and Number:
Japanese Patent JP2007231186
Kind Code:
A
Abstract:
To provide an adhesive composition for wood which has the excellent moldability (curability), adhesiveness and glue stability such as the viscosity increase with time.
The adhesive composition for wood, containing a resol-type phenol-formaldehyde resin (a) and an epoxy compound (b), is characterized in that the epoxy compound (b) is 0.1-20 parts by weight (in terms of a solid content) relative to 100 parts by weight of the resol-type phenol-formaldehyde resin (a).
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
SAKAYAMA HIROYUKI
SHIODA YOZO
SHIODA YOZO
Application Number:
JP2006055896A
Publication Date:
September 13, 2007
Filing Date:
March 02, 2006
Export Citation:
Assignee:
SUNBAKE CO LTD
International Classes:
C09J161/06; B27D1/10; C09J11/04; C09J163/00
Attorney, Agent or Firm:
Shinji Hayami