To provide a resin composition with which the problem that, as the water-proof low temperature curable water-based adhesive, mixtures of vinyl acetate resin emulsion with formaldehyde-based heat-curable resin such as urea resin or melamine resin, copolymers of crosslinkable monomers such as N-methylolacrylamide, and the like are conventionally used, these have water-resisting property, low temperature adhesiveness and the like but has problems such as containing plasticizers and releasing formaldehyde, is solved.
The adhesive composition is obtained by emulsion polymerization of vinyl acetate in the presence of acrylic resin containing carboxy-containing monomer by using polyvinyl alcohol and acetylated polyvinyl alcohol or acetoacetylated polyvinyl alcohol as the protective colloid. or by emulsion copolymerization of vinyl acetate monomer with a monomer having acetoacetyl group.
SATO KATSUNAO
NISHIMURA ATSUSHI
