Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2007131747
Kind Code:
A
Abstract:
To provide an adhesive composition having excellent adhesiveness, water and heat resistances, especially the adhesive composition suitable as an adhesive composition for paper or woodworking.
The adhesive composition comprises an aqueous emulsion (A) containing a polymer having carboxy groups, a polyamidopolyamine epihalohydrin (B) and a polyethyleneimine (C). The aqueous emulsion (A) containing the polymer having the carboxy groups is especially preferably obtained by carrying out emulsion polymerization of at least an ethylenically unsaturated monomer (b) in the presence of a water-soluble polymer (a) having the carboxy groups.
Inventors:
OISHI KEI
MITANI YOSHIYUKI
KURIMURA MUNETOSHI
MITANI YOSHIYUKI
KURIMURA MUNETOSHI
Application Number:
JP2005326639A
Publication Date:
May 31, 2007
Filing Date:
November 10, 2005
Export Citation:
Assignee:
SEIKO PMC CORP
International Classes:
C09J201/08; C09J157/10; C09J179/02