Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2007246729
Kind Code:
A
Abstract:
To provide an adhesive composition that exhibits less reduction in viscosity even under a high shear rate condition, for example, in the case of being used in a high speed coating line for paper processing, can inhibit the scattering of a paste during high speed coating, and is not dilatant, to thereby be easily handled during transportation, etc.
The adhesive composition is a vinyl acetate resin emulsion type adhesive composition which is formed by polymerizing a vinyl acetate monomer using 12-20 pts.wt. of a polyvinyl alcohol having 90-97.5% of saponification degree as a protective colloid, based on 100 pts.wt. of the vinyl acetate monomer.
COPYRIGHT: (C)2007,JPO&INPIT
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Inventors:
NISHIMURA ATSUSHI
SUGIURA HIROSHI
SUGIURA HIROSHI
Application Number:
JP2006073466A
Publication Date:
September 27, 2007
Filing Date:
March 16, 2006
Export Citation:
Assignee:
AICA KOGYO CO LTD
International Classes:
C09J151/06; C09J131/04
Domestic Patent References:
| JP2004043766A | 2004-02-12 | |||
| JP2001262100A | 2001-09-26 | |||
| JP2001131515A | 2001-05-15 |
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