Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2023160377
Kind Code:
A
Abstract:
To provide an adhesive composition which gives a cured product excellent in low dielectric characteristics and heat resistance and also excellent in adhesiveness to a resin and a metal.SOLUTION: As a result of intensive studies, the inventors have found that the problem can be solved by an adhesive composition which contains a component (A): a resin obtained by converting terminals of a bifunctional polyphenylene ether resin to vinyl groups, a component (B): a maleimide compound having two or more maleimide groups in one molecule, a component (C): an acid-modified styrenic elastomer, and a component (D): an isocyanate compound having two or more isocyanate groups in one molecule in a specific ratio.SELECTED DRAWING: None
Inventors:
MATSUSHIMA AYUMI
KAWAMURA YOSHINORI
MURATA JUMPEI
SAKAGUCHI YUJI
KAWAMURA YOSHINORI
MURATA JUMPEI
SAKAGUCHI YUJI
Application Number:
JP2022070714A
Publication Date:
November 02, 2023
Filing Date:
April 22, 2022
Export Citation:
Assignee:
TAOKA CHEMICAL CO LTD
International Classes:
C09J171/12; C09J7/35; C09J11/06; C09J11/08; C09J153/02; C09J175/04
Previous Patent: Power control device, control method, and control program
Next Patent: adhesive composition
Next Patent: adhesive composition