Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3526567
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve problems that, though an adhesive comprising a vinyl acetate resin emulsion has been widely used as it is water-based and easily used, the adhesive has undesirable film forming properties in winter and is not used without mixing a plasticizer, the plasticizer used decreases strengths and reduces heat resistance, the plasticizer is suspicious to be an environmental hormone and anxious to be used and so forth.
SOLUTION: This adhesive composition comprises the vinyl acetate emulsion produced by seed polymerizing vinyl acetate monomer to an acrylic resin emulsion prepared by emulsion polymerization using an acrylic monomer. The adhesive composition solves the above problems.
Inventors:
Yano, Masahiro
Kaede, Kazuki
Ishii, Naomi
Matsumoto, Masayuki
Kaede, Kazuki
Ishii, Naomi
Matsumoto, Masayuki
Application Number:
JP2002158794A
Publication Date:
May 17, 2004
Filing Date:
May 31, 2002
Export Citation:
Assignee:
AICA KOGYO CO LTD
GANTSU KASEI KK
GANTSU KASEI KK
International Classes:
C08F2/22; C08F265/00; C09J131/04; C09J133/00; C09J151/06; (IPC1-7): C09J151/06; C08F2/22; C08F265/00; C09J131/04; C09J133/00
Attorney, Agent or Firm:
谷 良隆