Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS62116679
Kind Code:
A
Abstract:
Two-pack adhesive systems which are curable by free radical polymerization at room temperatures are disclosed. The adhesives bond a variety of substrates, including metals and plastics. The adhesives comprise a first part containing free radical polymerizable unsaturated monomer and free radical source and a second part comprising free radical polymerizable unsaturated monomer and an activator compound for the free radical source. The activator compound is a bicyclic amidine, with 1,8-diaza-bicyclo [5.4.0] undec-7-ene being especially preferred. The use of cupric salts enhances polymerization rate.
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Inventors:
DENISU JIEROOMU ZARUCHIYA
Application Number:
JP23897486A
Publication Date:
May 28, 1987
Filing Date:
October 07, 1986
Export Citation:
Assignee:
LORD CORP
International Classes:
C09J11/06; C09J4/00; C09J175/16; (IPC1-7): C09J3/00; C09J3/14
Attorney, Agent or Firm:
Tsunemitsu Yamada