Title:
接合性導体ペースト
Document Type and Number:
Japanese Patent JP7122346
Kind Code:
B2
Abstract:
To provide a paste capable of being printed without unevenness by suppressing variation of viscosity at a printing temperature, quickly being sintered at a sintering temperature, having good conductivity and forming a conductor wire or a jointing structure excellent in jointing strength.SOLUTION: There is provided a jointing conductor paste for forming a conductor wire and/or a jointing structure for connecting electronic elements, which contains conductive particles and a solvent, silver particles as the conductive particles and a compound represented by the following formula (1), R1-O-(X-O)n-R2 (1), where R1 represents a monovalent group selected from a C1-5 aliphatic hydrocarbon group and a C3-5 alicyclic hydrocarbon group, X represents bivalent group selected from a C3-3 aliphatic hydrocarbon group and a C3-3 alicyclic hydrocarbon group, R2 represents a hydrogen atom or a monovalent group selected from a C1-5 aliphatic hydrocarbon group and a C3-5 alicyclic hydrocarbon group and n represents an integer of 1 to 3.SELECTED DRAWING: None
Inventors:
Yuji Suzuki
Yasuyuki Akai
Katsuaki Suganuma
酒 金▲てい▼
Hiroshi Zhang
Yasuyuki Akai
Katsuaki Suganuma
酒 金▲てい▼
Hiroshi Zhang
Application Number:
JP2020132264A
Publication Date:
August 19, 2022
Filing Date:
August 04, 2020
Export Citation:
Assignee:
Daicel Corporation
International Classes:
H01B1/22; C09D11/52; H05K3/32
Domestic Patent References:
| JP2012167259A |
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical