ADHESIVE FOR CONNECTING ELECTRODE AND BONDING METHOD USING THE ADHESIVE

Title:

ADHESIVE FOR CONNECTING ELECTRODE AND BONDING METHOD USING THE ADHESIVE

Document Type and Number:

Japanese Patent JP2001323246

Kind Code:

A

Abstract:

To obtain an insulating adhesive agent or adhesive film having repairability and conductance reliability and provide a method for connecting the agent, or the like.

The insulating adhesive agent 10 is produced by mixing a low- temperature curing adhesive having radical polymerization thermosetting mechanism with a high-temperature curing adhesive having epoxy-based thermosetting mechanism. The primary bonding (temporary bonding) of an IC chip 30 to a circuit board 20 is carried out at the 80% reaction temperature of the low- temperature curing adhesive using the obtained insulating adhesive agent 10 and the secondary bonding (main bonding) of the IC chip 30 to the circuit board 20 is performed at or above the 80% reaction temperature of the high- temperature curing adhesive.

Inventors:

YAMADA YUKIO
SAITO MASAO
TAKAMATSU OSAMU
ISHIMATSU TOMOYUKI

Application Number:

JP2000090197A

Publication Date:

November 22, 2001

Filing Date:

March 29, 2000

Export Citation:

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Assignee:

SONY CHEMICALS

International Classes:

C09J7/00; C09J5/06; C09J9/00; C09J9/02; C09J11/00; C09J163/00; C09J163/10; C09J201/00; H01B1/20; H01B5/16; H01L21/56; H01L21/60; H05K3/32; H05K3/36; H05K3/34; (IPC1-7): C09J201/00; C09J5/06; C09J7/00; C09J9/02; C09J11/00; C09J163/00; H01B1/20; H01B5/16; H01L21/60; H05K3/32; H05K3/36

Attorney, Agent or Firm:

Hideki Abe (1 person outside)

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