Title:
ADHESIVE FOR CORRUGATED BOARD
Document Type and Number:
Japanese Patent JP2010174095
Kind Code:
A
Abstract:
To provide a new adhesive for a corrugated board, which contains no formalin, gives excellent water-resistant adhesion, and has good viscosity stability.
The adhesive for the corrugated board is prepared by blending a water-resistant additive with an aqueous suspension base which contains non-gelatinized starch to develop corrugated board top adhesion by heat gelation and gelatinized starch as a carrier component, wherein a polyamide epoxy resin is formulated as the water-resistant additive, and all or a portion of the gelatinized starch is substituted by natural thickening polysaccharide (except starch) which can be a food additive.
Inventors:
MIURA TOSHIHIRO
NOZAKI YOSHIHIKO
NOZAKI YOSHIHIKO
Application Number:
JP2009016649A
Publication Date:
August 12, 2010
Filing Date:
January 28, 2009
Export Citation:
Assignee:
NIHON CORNSTARCH CORP
International Classes:
C09J103/02; C09J11/08; C09J163/00; C09J193/00
Attorney, Agent or Firm:
Akio Iida
Michiko Ema
Chiori Ueda
Takaya Muramatsu
Michiko Ema
Chiori Ueda
Takaya Muramatsu
Previous Patent: PREPREG, LAMINATE AND SUPPORTING MATERIAL FOR POLISHING OBJECT
Next Patent: ANISOTROPIC CONDUCTIVE ADHESIVE
Next Patent: ANISOTROPIC CONDUCTIVE ADHESIVE