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Title:
ADHESIVE FOR ELECTRONIC COMPONENT AND ADHESIVE FILM FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013216820
Kind Code:
A
Abstract:

To provide an adhesive for electronic component which is excellent in rapid hardenability and storage stability and has a high adhesive force and to provide an adhesive film for electronic component which is produced using the adhesive for electronic component.

An adhesive for electronic component contains: an epoxy resin, a hardener, an anionic hardening accelerator, and 1-60 pts.wt. of a sulfonium salt compound relative to 100 pts.wt. of the anionic hardening accelerator.


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Inventors:
TAKEDA KOHEI
HATAI MUNEHIRO
OKAYAMA HISATOSHI
Application Number:
JP2012090090A
Publication Date:
October 24, 2013
Filing Date:
April 11, 2012
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J163/00; C09J7/00; C09J11/06; H01L21/52
Domestic Patent References:
JPH06116366A1994-04-26
JP2004346247A2004-12-09
JP2008133354A2008-06-12
JP2008115293A2008-05-22
JP2003234017A2003-08-22
JP2009079216A2009-04-16
JP2001288249A2001-10-16
JP2010070634A2010-04-02
JPH06116366A1994-04-26
JP2004346247A2004-12-09
JP2008133354A2008-06-12
JP2008115293A2008-05-22
JP2003234017A2003-08-22
Attorney, Agent or Firm:
Atomi International Patent Office



 
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