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Title:
ADHESIVE ETHYLENIC COPOLYMER RESIN COMPOSITION AND LAMINATE USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2005213511
Kind Code:
A
Abstract:

To provide an adhesive ethylenic copolymer resin composition giving good adhesion to polystyrene resin, ABS resin, polyacrylonitrile resin and ethylene-vinyl acetate copolymer saponified resin even under high temperature conditions, and to provide a laminate using the composition.

The adhesive ethylenic copolymer resin composition comprises, at a specific ratio, [I] a specific long-chain branched ethylene-α-olefin copolymer, or the copolymer and a graft modified product of the copolymer with unsaturated carboxylic acid or its derivative, and [II] a tackifier, and has a specific density, MFR and crystallinity. The laminate has a three-layered structure comprising a resin selected from polystyrene-based polymer, ABS resin and acrylonitrile resin, the above mentioned composition and an ethylene-vinyl acetate copolymer saponified resin in this order, or a four or more-layered structure containing the three-layered structure.


Inventors:
KAWACHI HIDESHI
SAWADA YUJI
Application Number:
JP2005036602A
Publication Date:
August 11, 2005
Filing Date:
February 14, 2005
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
B32B27/32; C09J11/00; C09J123/00; C09J151/06; (IPC1-7): C09J123/00; B32B27/32; C09J11/00; C09J151/06
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura