Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2013253151
Kind Code:
A
Abstract:
To provide an adhesive film for circuit connection which has sufficiently low connection resistance and can obtain sufficient adhesive strength even when used for connecting circuit members at least one of which is composed of a plastic substrate.
An adhesive film for circuit connection, provided for bonding a first circuit member in which a first circuit electrode is formed on a plastic substrate and a second circuit member in which a second circuit electrode is formed on a second substrate so that the first circuit electrode and the second circuit electrode are connected electrically, contains (A) an organoaluminum complex, (B) a silane coupling agent, and (C) a curable component.
Inventors:
MORIYA TOSHIMITSU
KAWAKAMI SUSUMU
ARIFUKU MASAHIRO
KAWAKAMI SUSUMU
ARIFUKU MASAHIRO
Application Number:
JP2012129051A
Publication Date:
December 19, 2013
Filing Date:
June 06, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/00; C09J4/00; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01L21/60
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Toshiaki Sakanishi
Yoshinori Shimizu
Junichiro Sakamaki
Toshiaki Sakanishi