Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2023086476
Kind Code:
A
Abstract:
To provide an adhesive film for circuit connection which improves a conductive particle capturing rate between opposite electrodes of a circuit connection structure, and can reduce connection resistance of the circuit connection structure, even in the case of being mounted at low pressure.SOLUTION: An adhesive film 10A for circuit connection includes: a first adhesive layer 1 containing conductive particles 4, a cured product of a photocurable resin component and a first thermosetting resin component; and a second adhesive layer 2 which is provided on the first adhesive layer and contains a second thermosetting resin component. The photocurable resin component contains a radical-polymerizable compound and a photo-radical polymerization initiator. The photo-radical polymerization initiator contains a compound having an alkylphenone structure.SELECTED DRAWING: Figure 1
Inventors:
NAKAZAWA TAKASHI
NARUTOIMI KAZUYA
ICHIMURA TAKEYUKI
MORIYA TOSHIMITSU
NARUTOIMI KAZUYA
ICHIMURA TAKEYUKI
MORIYA TOSHIMITSU
Application Number:
JP2021201014A
Publication Date:
June 22, 2023
Filing Date:
December 10, 2021
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C09J9/02; C09J7/30; C09J11/02; C09J11/06; C09J163/00; C09J171/00; C09J201/00; H01L21/60; H05K1/14; H05K3/36
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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