Title:
耐熱保護用貼着フィルム
Document Type and Number:
Japanese Patent JP7285612
Kind Code:
B2
Abstract:
To provide a heat resistant protective adhesive film, which can be peeled from an adherend without an adhesive residue even after undergone a high temperature environment, can suppress transfer of an oligomer derived from a polyethylene terephthalate base material on a surface of an adhesive layer, and has flexibility.SOLUTION: In an adhesive film obtained by installing an anchor layer, and an adhesive layer in this order on one surface of a base material made of a polyethylene terephthalate resin, the adhesive layer is made of a silicone resin obtained by curing a silicone composition by an additive reaction, and the anchor layer contains each of colloidal silica, a resin, ethyl silicate hydrolyzate and polystyrene sulfonate in a specific range.SELECTED DRAWING: None
Inventors:
Juka Irie
Takashi Shimizu
Kyoichi Suzuki
Takashi Shimizu
Kyoichi Suzuki
Application Number:
JP2019109562A
Publication Date:
June 02, 2023
Filing Date:
June 12, 2019
Export Citation:
Assignee:
Fujicopian Co., Ltd.
International Classes:
C09J7/50; B32B27/00; C09D5/00; C09D7/61; C09D7/65; C09D167/02; C09D175/04; C09J7/38; C09J183/04
Domestic Patent References:
| JP2017197749A | ||||
| JP2012223904A | ||||
| JP2010135466A | ||||
| JP2003246972A | ||||
| JP2017014308A | ||||
| JP2006152266A |