Title:
接着フィルムおよびその利用
Document Type and Number:
Japanese Patent JP4625458
Kind Code:
B2
Abstract:
Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than −0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.
Inventors:
Yanagi Masami Tadashi
Kinjo Eitai
Kinjo Eitai
Application Number:
JP2006529248A
Publication Date:
February 02, 2011
Filing Date:
July 20, 2005
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
B32B27/34; B29C41/22; B29C55/08; B32B15/088; C09J7/20; C09J7/25; C09J179/08; B29K79/00; B29L7/00; B29L9/00
Domestic Patent References:
JP2001270034A | 2001-10-02 | |||
JP2001164006A | 2001-06-19 | |||
JP2003335874A | 2003-11-28 | |||
JPS56118421A | 1981-09-17 |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office