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Title:
接着フィルム、これを含む接着フィルム付き積層体、及びこれを含む金属箔積層体
Document Type and Number:
Japanese Patent JP7164645
Kind Code:
B2
Abstract:
Provided are: an adhesive film formed of a composition for an adhesive film comprising a binder resin, an epoxy resin, and a filler; a laminate with an adhesive film attached thereto comprising the same; and a metal clad laminate comprising the same. The binder resin includes a carboxylic acid-modified olefin-based resin and a polyphenylene ether-based resin, and the adhesive film has a dielectric constant (Dk) of 2.6 or less, measured at 1-10 GHz and 20-80℃ after curing of 2.6 or less, a dissipation factor (DF) of 0.005 or less, and a moisture absorption rate after curing of 0.1% or less.

Inventors:
Song Gun Kim
Jamin Ku
Song Chu Yu
Myung Whun Kwon
Hyun Gyu Park
Application Number:
JP2021032113A
Publication Date:
November 01, 2022
Filing Date:
March 01, 2021
Export Citation:
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Assignee:
INNOX Advanced Materials Co.,Ltd.
International Classes:
C09J7/35; B32B27/32; B32B27/38; C08K3/36; C08L23/26; C08L27/12; C08L63/00; C08L71/12; C09J11/04; C09J11/08; C09J123/26; C09J125/04; C09J163/00; C09J171/10
Domestic Patent References:
JP2018135506A
JP2018141053A
JP2016166347A
Foreign References:
WO2019230445A1
WO2018131571A1
WO1998056011A1
WO1999003903A1
WO2016147984A1
WO2019172109A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation