Title:
ADHESIVE FILM FOR SEMICONDUCTOR, SEMICONDUCTOR ADHESIVE FILM-APPLIED LEAD FRAME USING THE SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005220356
Kind Code:
A
Abstract:
To provide an adhesive film for semiconductor, capable of bonding, in a semiconductor device, semiconductor elements to a lead frame at low temperatures, and having good temperature cycling endurance.
The adhesive film for semiconductor comprises a substrate film and adhesive layers formed on both surfaces of the substrate. The adhesive layer is made of an adhesive having a glass transition temperature of ≤200°C, a linear expansion coefficient of ≤70 ppm and a storage modulus of ≤3 GPa, and the total thickness of the adhesive film is 43-57 μm.
Inventors:
TANABE YOSHIYUKI
MATSUURA SHUICHI
MATSUURA SHUICHI
Application Number:
JP2005067647A
Publication Date:
August 18, 2005
Filing Date:
March 10, 2005
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/02; C09J177/00; C09J179/08; C09J201/00; (IPC1-7): C09J201/00; C09J7/02
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu